Hi-link fingerprint recognition module HLK-ZW0919 capacitive touch ball racket shaped fingerprint door lock acquisition sensor module test kit/ development board

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Product Details

fingerprint module select list (2) Product introduction

Fingerprint identification module is used for user's identity determination, when the user touches the fingerprint identification module with his/her finger, the fingerprint identification module will scan the user's fingerprints, and the algorithm chip can obtain the fingerprint image data for registration and comparison operation. This product is suitable for various applications that require fingerprint identification.

Parameters

Technical indicators

Item	Parameter
Storage	100 fingerprint data as standard
Sensor type	Capacitive touch sensor
Resolution	508DPI
FRR.	<3%
FAR.	<0.001%
Fingerprint sensor shape	orbicular
Image gray level	8-bit grayscale
Service life	million times
Static electricity test	Contact discharge ±8KV/Air discharge ±15KV
Data interface	UART (TTL level)
Sensor surface hardness	3H
Working temperature and humidity range	-25℃~+70℃; 45%~85%RH
Storage temperature and humidity range	-40℃~+85℃; 45%~95%RH

Mechanical characteristics

Project	Description	Unit
Dimensions	Φ14mm	mm
Ribbon	5.6*4.8	mm
Resolution ratio	112*96	mm

ZW0919-04

Electrical parameters

Item		Min	Typical	Max	Unit
Supply voltage		3.0	3.3	3.6	V
Standby current (sensor)		-	10	12	μA
Maping time		50	60	70	ms
Operating current (algorithm MCU)		24	35	50	mA
Eigenvalue generation time		65	70	80	ms
Comparison time		130	600	1100	ms
Power-on start time		-	70	80-	ms
ESD rating	Non-contact discharg	-	15	-	KV
ESD rating	Contact discharge	-	8	-	KV

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Hi-link fingerprint recognition module HLK-ZW0919 capacitive touch ball racket shaped fingerprint door lock acquisition sensor module test kit/ development board