Hi-link surface array semiconductor fingerprint recognition module HLK-ZW0901 capacitive touch fingerprint sensor module

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Product Details

fingerprint module select list (2)

ZW0901-2

Product introduction

Consumers use fingerprint recognition modules to determine user identity. When the user touches the fingerprint recognition module with his finger, the fingerprint recognition module will

scan the user's fingerprint, and the algorithm chip can obtain the fingerprint image data for registration and comparison.

Parameters

Technical indicators

Item	Parameter
Storage	50 fingerprint data as standard
Sensor type	Capacitive touch sensor
Resolution	508DPI
FRR.	<3%
FAR.	<0.001%
Fingerprint sensor shape	round
Image gray level	8-bit grayscale
Service life	one million times
Static electricity test	Contact discharge ±8KV/Air discharge ±15KV
Data interface	UART (TTL level)
Sensor surface hardness	3H
Working temperature and humidity range	-30℃~+70℃; 45%~85%RH
Storage temperature and humidity range	-40℃~+85℃; 45%~95%RH

Mechanical characteristics

Project	Description	Unit
Dimensions	Φ12.8mm	mm
Ribbon	5.6*4.8	mm
Resolution ratio	112*96	mm

ZW0901-6

ZW0901-04

Electrical parameters

Item		Min	Typical	Max	Unit
Supply voltage		3.0	3.3	3.6	V
Standby current (sensor)		-	9	12	μA
Operating current (algorithm MCU)		-	25	50	mA
Picture collection time		150	155	160	ms
Eigenvalue generation time		200	220	250	ms
Comparison time		10	180	400	ms
Power-on start time		-	100	-	ms
ESD rating	Non-contact discharg	-	-	15	KV
ESD rating	Contact discharge	-	-	8	KV

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Hi-link surface array semiconductor fingerprint recognition module HLK-ZW0901 capacitive touch fingerprint sensor module